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With our ODM+ model, we're the only company with true end-to-end capabilities for your unique CSP solution. We'll help you design, build and deploy worldwide - all in-house.
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We understand the difference between CSP users and enterprise customers. As a strategic partner you can trust to deliver value for your CSP needs, we offer rapid innovation, quality products, aggressive pricing, quick delivery, unique time-to-bid cycles, and flexible service and support.
AI and HPC are enabling breakthroughs in a wide variety of industries. Yet, as this technology progresses, virtually every component of a server—CPUs, memory, accelerators, networking, etc.—is consuming two to four times the power that similar components did a decade ago.
By 2030, data center power and water usage are expected to double, prompting cloud service providers (CSPs) and colocation facilities to prioritize Power Usage Effectiveness (PUE) as a key metric. Liquid Cooling is emerging as a key enabler of the highest performing AI and HPC workloads.