ThinkSystem SD650 V3 server

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Liquid cooling innovation for a highly efficient data center

ThinkSystem SD650 V3 Supercomputing Server

  • Up to 2 5th Gen Intel® Xeon® Scalable processors, CPUs up to 385 W, plus the HBM CPUs
  • Up to 16x 128GB TruDDR5 memory
  • Up to 4 SSDs/NVMe U.2; 1 M.2 local storage
  • Support for InfiniBand
  • Powered by Lenovo Neptune™ Liquid Cooling technology
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Download Product Spec Sheet ( PDF )
Tech Specs
Form Factor

Full-wide 1U tray (two SD650 V3 nodes per tray, six per DW612S Enclosure)

Chassis

DW612S Enclosure (6U)"

Processor

Two 5th Gen Intel® Xeon® Scalable processors per node, or 2x 4th Gen Intel® Xeon® CPU Max series processors with HBM per node; 2x nodes per 1U tray

Memory

Up to 2.0TB using 16x 128GB 5600 MHz per node

I/O Expansion

Up to 2x PCIe Gen5 x16 low-profile adapter slots (2x supported without internal storage) per node for NDR InfiniBand. Shared I/O and SocketDirect supported.

Internal Storage

Up to 4x 2.5" SATA/NVMe SSDs (7mm height) or 2x 2.5" NVMe SSDs (15mm height) per node; up to 1x liquid cooled M.2 NVMe SSD for both operating system boot and storage functions

RAID Support

SATA controller with SW RAID or Intel VROC

Network Interface

Two onboard Ethernet interfaces: 2x 25GbE SFP28 LOM (1Gb, 10Gb or 25Gb capable; supports NC-SI) and 1x 1GbE RJ45 (supports NC-SI)

Power Management

Rack-level power capping and management via open-source management software Confluent and application-level energy optimization through Energy Aware Runtime (EAR)

Systems Management

Systems management using Lenovo HPC&AI Software stack with Lenovo Intelligent Computing Orchestration (LiCO) portal and XClarity Controller (XCC). Supports TPM 2.0 for advanced cryptographic functionality. SMM management module in the enclosure, supports daisy chaining to reduce cabling requirements

Front access

All adapters and drives are accessible from the front of the server. Front ports include KVM breakout connector and External Diagnostics Handset port for local management.

Rear access

2x RJ45 on the SMM management module in the enclosure for XCC with daisy chain support; USB 2.0 for SMM FFDC log collection

Power Supply

Up to 9x air CFF v4 (2400W PT, 2600W TT) /

Up to 3x Direct Water Cooled Power Supply (7200W) 80+ Titanium

N+1 redundancy (only air-cooled / without acceleration on DWC)

Cooling Design

Direct Water Cooling at the heat source with up to 45°C inlet water temperature

OS Support

Red Hat, SUSE, Rocky Linux (with LeSI support); Visit lenovopress.com/osig for more information.

Limited Warranty

3-year customer replaceable unit and onsite limited warranty, next business day 9x5, service upgrades available

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